This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

SHENZHEN, GUANGDONG, CHINA, February 7, 2026 /EINPresswire.com/ -- As global industries continue advancing toward ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/cv7fbg/pressure_sensor) has announced the addition of the "Pressure Sensor ...

Common to all types of manufacturing automation is a reliance on effective detection and measurement of real-world conditions. In the past, discrete manufacturing (production of parts and equipment) ...

Learn how smart sensors are transforming manufacturing by enabling predictive maintenance, improving diagnostics and enhancing operational efficiency. Discover strategies to overcome compatibility ...

Sensors at left (top to bottom): Heat flux (TFX), in-mold dielectric (Lambient), ultrasonic (Univ. of Augsburg), disposable dielectric (Synthesites) and microwire (AvPro) in between penny and ...

A network of 74 sensors — 57 of which were ultrasonic sensors developed by the University of Augsburg (shown at top and as light blue dots in upper and low mold halves) — were used in the T-RTM ...