MIT researchers have designed silicon structures that can perform calculations in an electronic device using excess heat ...
MIT engineers use heat-conducting silicon microstructures to perform matrix multiplication with >99% accuracy hinting at ...
Engineers at MIT have turned one of computing’s biggest headaches, waste heat, into the main act. By sculpting “dust-sized” silicon structures that steer heat as precisely as electrical current, they ...
Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The approach enables the 50-micron-thick fiber to contain 10,000 transistors in a ...