Samsung said it has begun mass production and commercial shipments of a new generation of high-bandwidth memory, called HBM4.

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, ...

Designed to take on high-bandwidth memory in data centers, Z-Angle memory (ZAM) leverages diagonal interconnects for improved ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...

Micron, SK Hynix and Samsung Electronics — make up nearly the entire RAM market, and they're benefitting from this shortage.

Company plans to start shipping HBM4 chips after Lunar New Year holiday, for use in graphics processing units - Anadolu Ajansı ...

The high-bandwidth HBM4 chips are seen as a key component needed to scale-up the vast data centres powering the explosion in artificial intelligence.

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...

Fueled by the AI boom, the global foundry and memory sectors are expected to hit record highs in 2026. However, the memory market is projected to ...

Professor Kim Joung-ho of the Korea Advanced Institute of Science and Technology (KAIST), known for devising the basic ...